View TDA8552TTS3_1005246.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TDA8552T; TDA8552TS 2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
Product specification Supersedes data of 1998 Jun 02 File under Integrated Circuits, IC01 2002 Jan 04
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
FEATURES * One pin digital volume control (for each channel) * Volume setting with up/down pulses * Auto repeat function on volume setting * Headphone sensing * Maximum gain set by selection pin * Low sensitivity for EMC radiation * Internal feedback resistors * Flexibility in use * Few external components * Low saturation voltage of output stage * Standby mode controlled by CMOS compatible levels * Low standby current * No switch-on/switch-off plops * High supply voltage ripple rejection * Protected against electrostatic discharge * Outputs short-circuit safe to ground, VDD and across the load * Thermally protected. APPLICATIONS * Portable consumer products * Notebook computers * Communication equipment. ORDERING INFORMATION TYPE NUMBER TDA8552T TDA8552TS PACKAGE NAME SO20 DESCRIPTION
TDA8552T; TDA8552TS
GENERAL DESCRIPTION The TDA8552T is a two channel audio power amplifier that provides an output power of 2 x 1.4 W into an 8 load using a 5 V power supply. The circuit contains two BTL power amplifiers, two digital volume controls and standby/mute logic. Volume and balance of the amplifiers are controlled using two digital input pins which can be driven by simple push-buttons or by a microcontroller. Using the selection pin (GAINSEL) the maximum gain can be set at 20 or 30 dB. The headphone sense input (HPS) can be used to detect if a headphone is plugged into the jack connector. If a headphone is plugged into the jack connector the amplifier switches from the BTL to the SE mode and the BTL loudspeakers are switched off. This also results in a reduction of quiescent current consumption. The TDA8552T is contained in a 20-pin small outline package. For the TDA8552TS, which is contained in a 20-pin very small outline package, the maximum output power is limited by the maximum allowed ambient temperature. More information can be found in Section "Thermal design considerations". The SO20 package has the four corner leads connected to the die pad so that the thermal behaviour can be improved by the PCB layout.
VERSION SOT163-1 SOT266-1
plastic small outline package; 20 leads; body width 7.5 mm
SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm
2002 Jan 04
2
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
QUICK REFERENCE DATA SYMBOL VDD Iq PARAMETER supply voltage quiescent supply current BTL mode; VDD = 5 V BTL mode; VDD = 3.3 V SE mode; VDD = 5 V SE mode; VDD = 3.3 V Istb Po Gv standby current output power voltage gain THD = 10%; RL = 8 ; VDD = 5 V low gain; maximum volume low gain; minimum volume high gain; maximum volume high gain; minimum volume Nstep THD SVRR number of volume steps total harmonic distortion supply voltage ripple rejection Po = 0.5 W CONDITIONS - - - - - 1 - - - - - - 50
TDA8552T; TDA8552TS
MIN. 2.7 5
TYP. 14 10 8.5 5 1 1.4 20 -60 30 -50 64 0.1 -
MAX. 5.5 20 15 12 8 10 - - - - - - - - V
UNIT mA mA mA mA A W dB dB dB dB % dB
2002 Jan 04
3
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
BLOCK DIAGRAM
TDA8552T; TDA8552TS
handbook, full pagewidth
VDD1 3 IN1 17 20 k VOLUME CONTROL
VDD2 8
VDD3 13
VDD4 18
MASTER 15 k 20 dB 3.4 k VDD down 30 dB 1.6 k 0.5VDD 15 k 0.5VDD
12 OUT1+
0.5VDD
UP/DOWN COUNTER up UP/DOWN1 6
20 k 20 k
INTERFACE
SLAVE
19 OUT1-
SVR
16 0.5VDD
IN2 15 20 k
15 k VOLUME CONTROL
TDA8552T
MASTER 15 k 20 dB 3.4 k VDD down 15 k 30 dB 1.6 k 0.5VDD 0.5VDD
2 OUT2+
0.5VDD
UP/DOWN COUNTER up UP/DOWN2 7
20 k 20 k
INTERFACE
SLAVE
9 OUT2-
0.5VDD 15 k
MODE 5 HPS 4 STANDBY/MUTE AND OPERATING GAIN SELECTION 14 GAINSEL 1, 10, 11, 20 GND1 to GND4
MGM608
Fig.1 Block diagram.
2002 Jan 04
4
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
PINNING SYMBOL GND1 OUT2+ VDD1 HPS MODE PIN(1) 1 2 3 4 5 DESCRIPTION ground 1, substrate/leadframe positive loudspeaker terminal output channel 2 supply voltage 1 digital input for headphone sensing digital trinary input for mode selection (standby, mute and operating) digital trinary input for volume control channel 1 digital trinary input for volume control channel 2 supply voltage 2 negative loudspeaker terminal output channel 2 ground 2, substrate/leadframe ground 3, substrate/leadframe positive loudspeaker terminal output channel 1 supply voltage 3 digital input for gain selection audio input channel 2 half supply voltage, decoupling ripple rejection audio input channel 1 supply voltage 4 negative loudspeaker terminal output channel 1 ground 4, substrate/leadframe
handbook, halfpage
TDA8552T; TDA8552TS
GND1 1 OUT2+ 2 VDD1 3 HPS 4 MODE 5
20 GND4 19 OUT1- 18 VDD4 17 IN1 16 SVR
UP/DOWN1 UP/DOWN2 VDD2 OUT2- GND2 GND3 OUT1+ VDD3 GAINSEL IN2 SVR IN1 VDD4 OUT1- GND4 Note
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
TDA8552T
UP/DOWN1 6 UP/DOWN2 7 VDD2 8 OUT2- 9 GND2 10
MGM610
15 IN2 14 GAINSEL 13 VDD3 12 OUT1+ 11 GND3
Fig.2 Pin configuration.
1. For the SO20 (SOT163-1) package only: the ground pins 1, 10, 11 and 20 are mechanically connected to the leadframe and electrically to the substrate of the die. On the PCB the ground pins can be connected to a copper area to decrease the thermal resistance.
2002 Jan 04
5
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
FUNCTIONAL DESCRIPTION The TDA8552T is a 2 x 1.4 W BTL audio power amplifier capable of delivering 2 x 1.4 W output power into an 8 load at THD = 10% using a 5 V power supply. The gain of the amplifier can be set by the digital volume control. The gain in the maximum volume setting is 20 dB (low gain) or 30 dB (high gain). This maximum gain can be selected by the gain selection pin. The headphone sense input (HPS) can be used to detect if a headphone is plugged into the jack connector. If a headphone is plugged into the jack connector the amplifier switches from the BTL to the SE mode and the BTL loudspeakers are switched off. This also results in a reduction of quiescent current consumption. Using the MODE pin the device can be switched to the standby condition, the mute condition or the normal operating condition. The device is protected by an internal thermal shutdown protection mechanism. Power amplifier The power amplifier is a Bridge-Tied Load (BTL) amplifier with a complementary CMOS output stage. The total voltage loss for both output power MOS transistors is within 1 V and with a 5 V supply and an 8 loudspeaker an output power of 1.4 W can be delivered. The total gain of this power amplifier can be set at 20 or 30 dB by the gain selection pin. Gain selection The gain selection can be used for a fixed gain setting, depending on the application. The gain selection pin must be hard wired to ground (20 dB) or to VDD (30 dB). Gain selecting during the operation is not advised, switching is not guaranteed plop free. Input attenuator The volume control operates as a digitally controlled input attenuator between the audio input pin and the power amplifier. In the maximum volume control setting the attenuation is 0 dB and in the minimum volume control setting the typical attenuation is 80 dB. The attenuation can be set in 64 steps by the UP/DOWN pin. Both attenuators for channels 1 and 2 are separated from each other and are controlled by there own UP/DOWN pin. Balance control can be arranged by applying UP/DOWN pulses only on pins 6 and 7, see Fig.5. Volume control
TDA8552T; TDA8552TS
Each attenuator is controlled with its own UP/DOWN pin (trinary input): * Floating UP/DOWN pin: volume remains unchanged * Negative pulses: decreasing volume * Positive pulses: increasing volume. Each pulse on the UP/DOWN pin results in a change in 80 gain of ----- = 1.25 dB (typical value). 64 In the basic application the UP/DOWN pin is switched to ground or VDD by a double push-button. When the supply voltage is initially connected, after a complete removal of the supply, the initial state of the volume control is an attenuation of 40 dB (low volume), so the gain of the total amplifier is -20 dB in the low gain setting or -10 dB in the high gain setting. After powering-up, some positive pulses have to be applied to the UP/DOWN pin for turning up to listening volume. Auto repeat If the UP/DOWN pin is LOW or HIGH for the wait time (twait in seconds) (one of the keys is pressed) then the device starts making up or down pulses by itself with a frequency 1 given by ------- (repeat function). t rep The wait time and the repeat frequency are set using an internal RC oscillator with an accuracy of 10%. Volume settings in standby mode When the device is switched with the MODE select pin to the mute or the standby condition, the volume control attenuation setting keeps its value, under the assumption that the voltage on the VDD pin does not fall below the minimum supply voltage. After switching the device back to the operation mode, the previous volume setting is maintained. In the standby mode the volume setting is maintained as long as the minimum supply voltage is available. The current consumption is very low, approximately 1 A (typ.). In battery fed applications the volume setting can be maintained during battery exchange if there is a supply capacitor available.
2002 Jan 04
6
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
Mode select pin The device is in the standby mode (with a very low current consumption) if the voltage at the MODE pin is between VDD and VDD - 0.5 V. At a mode select voltage level of less than 0.5 V the amplifier is fully operational. In the range between 1 V and VDD - 1 V the amplifier is in the mute condition. The mute condition is useful for using it as a `fast mute', in this mode the output signal is suppressed, while the volume setting remains at its value. It is advised to keep the device in the mute condition while the input capacitor is being charged. This can be achieved by holding the MODE pin at a level of 0.5VDD, or by waiting approximately 100 ms before giving the first volume-UP pulses. Headphone sense pin (HPS) A headphone can be connected to the amplifier by using a coupling capacitor for each channel. The common ground pin of the headphone is connected to the ground of the amplifier, see Fig.4. By using the HPS pin as illustrated in Fig.4, the TDA8552T detects if a headphone jack plug is inserted into the connector.
TDA8552T; TDA8552TS
When no headphone is plugged in, the voltage level at the HPS pin will remain LOW. A voltage less than VDD - 1 V at the HPS pin will keep the device in the BTL mode, thus the loudspeakers can be operational. If the HPS pin is not connected then the device will remain in the BTL mode. When a headphone is plugged into the connector, the voltage at the HPS pin will be set to VDD. The device then switches to the Single-Ended (SE) mode, this means that the slave power amplifiers at the outputs OUT1- and OUT2- will be switched to the standby mode. This results in floating outputs OUT1- and OUT2-, the loudspeaker signal is thus attenuated by approximately 80 dB and only the headphone can operate. One of the benefits of this system is that the loudspeaker current does not flow through the jack connector switch, which could give some output power loss. The other benefit is that the quiescent current is reduced when the headphone jack is inserted.
2002 Jan 04
7
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VDD Vi IORM Tstg Tamb Vsc Ptot supply voltage input voltage repetitive peak output current storage temperature operating ambient temperature AC and DC short-circuit safe voltage maximum power dissipation SO20 SSOP20 PARAMETER
TDA8552T; TDA8552TS
CONDITIONS operating
MIN. -0.3 -0.3 - -55 -40 - - -
MAX. +5.5 VDD + 0.3 1 +150 +85 5.5 2.2 1.1 V V A
UNIT
C C V W W
THERMAL CHARACTERISTICS See Section "Thermal design considerations" in Chapter "Test and application information". SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient for the TDA8552T (SO20) for the TDA8552TS (SSOP20) in free air extra copper in free air extra copper Table 1 Power rating; note 1 MUSIC POWER VDD (V) RL () Po (w) THD = 10% 0.9 0.6 0.3 0.035 2.0 1.4 0.8 0.09 0.9 1.4 OPERATION Pmax (W) BTL BTL BTL headphone BTL BTL BTL headphone BTL BTL 0.55 0.28 0.14 0.03 1.25 0.65 0.32 0.07 1.1 1.25 Tamb(max) (C) SO20 120 134 142 150 81 114 132 146 continuous sine wave 3.3 5 Note 1. The power rating is based on Rth(j-a) with recommended copper pattern of at least 4 x 1 cm2 to the corner leads and copper under the IC package. 4 8 89 81 62 50 SSOP20 106 127 139 150 50 98 124 144 60 55 110 80 K/W K/W K/W K/W CONDITIONS VALUE UNIT
3.3 3.3 3.3 3.3 5.0 5.0 5.0 5.0
4 8 16 32SE 4 8 16 32SE
2002 Jan 04
8
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
QUALITY SPECIFICATION
TDA8552T; TDA8552TS
Quality specification in accordance with "SNW-FQ-611 part E", if this type is used as an audio amplifier. DC CHARACTERISTICS VDD = 5 V; Tamb = 25 C; RL = 8 ; VMODE = 0 V; total gain setting at 7 dB; according to Fig.4.; unless otherwise specified. SYMBOL VDD IDD PARAMETER supply voltage supply current BTL mode; VDD = 5 V; RL = ; note 1 SE mode; VDD = 5 V BTL mode; VDD = 3.3 V; RL = ; note 1 SE mode; VDD = 3.3 V Istb VO standby current DC output voltage VMODE = VDD note 2 GAINSEL = 0 V GAINSEL = VDD standby mute operating IMODE mute Gain select pin VGAINSEL IGAINSEL VHPS IHPS input voltage input current low gain (20 dB) high gain (30 dB) Headphone sense pin input voltage input current SE mode; headphone detected VDD - 1 - - - VDD 1 V A 0 4.1 - - - - 0.6 VDD 1 V V A input current mute attenuation 0 < VMODE < VDD note 3 CONDITIONS - - - - - - - - MIN. 2.7 5 14 8.5 10 5 1 2.5 - - TYP. MAX. 5.5 20 12 15 8 10 - 50 150 UNIT V mA mA mA mA A V mV mV
VOUT+ - VOUT- differential output offset voltage Mode select pin VMODE input voltage
VDD - 0.5 - 1 0 - 80 - - - tbf
VDD 0.5 1 -
V V A dB
VDD - 1.4 V
2002 Jan 04
9
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
SYMBOL Volume control tW trep Vth(up) Vfloat(max) Vfloat(min) Vth(down) II(up/down) twait trep Gv(l) pulse width pulse repetition time UP/DOWN pin UP threshold level UP/DOWN pin floating high level UP/DOWN pin floating low level UP/DOWN pin DOWN threshold level input current UP/DOWN pin auto repeat wait time repeat time key pressed 0 < VUP/DOWN < VDD PARAMETER CONDITIONS
TDA8552T; TDA8552TS
MIN. - - - - - - -
TYP. - -
MAX.
UNIT
50 100 4.1 - 1.0 0 - - - 19 tbf 29 tbf - - 14 -
ns ns V V V V A ms ms
VDD 3.4 - 0.6 200 - - 21 tbf 31 tbf - - - 1.75
500 130
Volume attenuator low gain; maximum volume (including power amplifier) low gain; minimum volume (including power amplifier) Gv(h) high gain; maximum volume (including power amplifier) high gain; minimum volume (including power amplifier) Nstep Gv Zi Vi(max)(rms) Notes 1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal DC output offset voltage to 2 x --------------------------------------------------------------- - RL 2. The DC output voltage with respect to ground is approximately 0.5VDD. 3. Output voltage in mute position is measured with an input of 1 V (RMS) in a bandwidth of 20 kHz, so including noise, gain select pin is LOW (0 V). number of gain steps variation of gain per step input impedance maximum input voltage (RMS value) 20 -60 30 -50 64 1.25 20 - dB dB dB dB
dB k V
2002 Jan 04
10
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T; TDA8552TS
AC CHARACTERISTICS (VDD = 3.3 V) Tamb = 25 C; RL = 8 ; f = 1 kHz; total gain setting at 7 dB; VMODE = 0 V; gain select pin is at 0 V (maximum gain = 20 dB); according to Fig.4. SYMBOL Po PARAMETER output power CONDITIONS THD = 10%; RL = 4 THD = 10%; RL = 8 THD = 10%; RL = 16 THD = 0.5%; RL = 4 THD = 0.5%; RL = 8 THD = 0.5%; RL = 16 THD Vo(n) SVRR Vi(max) sup cs Notes 1. Volume setting at maximum. 2. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), Rsource = 0 , gain select pin is LOW (0 V). 3. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive supply rail, gain select pin is LOW (0 V). 4. Channel suppression is measured at the output with a source impedance of Rsource = 0 at the input and a frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set at 2 V (RMS). total harmonic distortion noise output voltage supply voltage ripple rejection maximum input voltage channel suppression channel separation Po = 0.1 W; note 1 note 2 note 3 THD = 1%; Gv = -50 to 0 dB VHPS = VDD; note 4 - - - - - - - - tbf - - - MIN. TYP. 0.9 0.6 0.3 0.6 0.4 0.2 0.1 60 55 - 80 55 - - - - - - - - - 1.1 - - MAX. W W W W W W % V dB V dB dB UNIT
2002 Jan 04
11
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T; TDA8552TS
AC CHARACTERISTICS (VDD = 5 V) Tamb = 25 C; RL = 8 ; f = 1 kHz; total gain setting at 7 dB; VMODE = 0 V; Gain select pin is at 0 V (maximum gain = 20 dB); according to Fig.4; package is SO20. SYMBOL Po PARAMETER output power CONDITIONS THD = 10%; RL = 8 THD = 10%; RL = 16 THD = 0.5%; RL = 8 THD = 0.5%; RL = 16 THD Vo(n) SVRR Vi(max) sup cs Notes 1. Volume setting at maximum. 2. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), Rsource = 0 . 3. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive supply rail, gain select pin is LOW (0 V). 4. Channel suppression is measured at the output with a source impedance of Rsource = 0 at the input and a frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set at 1 V (RMS). total harmonic distortion noise output voltage supply voltage ripple rejection a maximum input voltage channel suppression channel separation Po = 0.1 W; note 1 Po = 0.5 W; note 1 GAINSEL. = 0 V; note 2 GAINSEL. = VDD; note 2 note 3 THD = 1%; Gv = -50 to 0 dB VHPS = VDD; note 4 - 0.6 - - - - - 50 - 70 50 MIN. 1.0 TYP. 1.4 0.8 1.0 0.6 0.15 0.1 60 100 55 - 80 - - - - - 0.4 0.3 100 - - 1.75 - - MAX. W W W W % % V V dB V dB dB UNIT
2002 Jan 04
12
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T; TDA8552TS
AC CHARACTERISTICS (FOR HEADPHONE; RL = 32 ; CONNECTED SE) VDD = 5 V; Tamb = 25 C; f = 1 kHz; total gain setting at 20 dB; VMODE = 0 V; gain select pin is 0 V (maximum gain = 20 dB); according to Fig.4. SYMBOL Po PARAMETER output power CONDITIONS THD = 10%; VDD = 3.3 V THD = 10%; VDD = 5.0 V - - MIN. TYP. 35 90 25 60 0.04 60 55 - - - - - - - 100 - 1.75 - MAX. UNIT mW mW mW mW % V dB V dB
THD = 0.5%; VDD = 3.3 V - THD = 0.5%; VDD = 5.0 V - THD Vo(n) SVRR Vi(max) cs Notes total harmonic distortion noise output voltage supply voltage ripple rejection maximum input voltage channel separation Po = 60 mW note 1 note 2 THD = 1%; Gv = -50 to 0 dB - - 50 - 50
1. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), Rsource = 0 , gain select pin is LOW (0 V). 2. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive supply rail, gain select pin is LOW (0 V).
handbook, full pagewidth
tr VDD Vth(UP) Vfloat(max)
trep
tw increasing volume
floating VUP/DOWN Vfloat(min) Vth(DOWN) 0 t
decreasing volume tr trep tw
MGM611
The rise time (tr) of the pulse may have any value.
Fig.3 Timing UP/DOWN pin.
2002 Jan 04
13
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TEST AND APPLICATION INFORMATION
TDA8552T; TDA8552TS
handbook, full pagewidth
VDD1, 2 C1 330 nF VIN1 3, 8 IN1 17 20 k VOLUME CONTROL MASTER 15 k 20 dB UP/DOWN COUNTER up up volume control down R5 2.2 k C7 100 nF UP/DOWN1 6 C3 220 F C2 330 nF VIN2 IN2 15 20 k VOLUME CONTROL MASTER 15 k 20 dB UP/DOWN COUNTER VDD up up volume control down R6 2.2 k UP/DOWN2 7 C8 100 nF down 15 k 1.6 k 0.5VDD 0.5VDD 9 OUT2- 3.4 k VDD 30 dB 20 k 20 k 8 2 OUT2+ down 3.4 k VDD 30 dB 1.6 k 0.5VDD 15 k SVR 16 0.5VDD 15 k 0.5VDD 19 OUT1- 20 k 20 k 8 12 OUT1+ C5 220 F 0.5VDD VDD3, 4 13, 18 C3 100 nF C4
VDD = 5 V 220 F
R1 1 k
VDD
INTERFACE
SLAVE
headphone jack tip ring sleeve C6 220 F R4 1 k
TDA8552T
0.5VDD
INTERFACE
SLAVE
0.5VDD 15 k
VDD standby mute MODE 5 operating HPS 4 STANDBY/MUTE AND OPERATING GAIN SELECTION 14 GAINSEL 1, 10, 11, 20 GND1 to GND4 R2 820 k VDD
R3 100 k VDD
ground
MGM609
Fig.4 Test and application diagram.
2002 Jan 04
14
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
Test conditions Tamb = 25C if not specially mentioned; VDD = 5 V; f = 1 kHz, RL = 8 , Gv = 20 dB, audio band-pass 22 Hz to 22 kHz. The thermal resistance (in standard print, without extra copper) = 110 K/W for the SSOP20; the maximum sine wave power dissipation is: 150 - 25 --------------------- = 1.14 W 110 For Tamb = 60 C the maximum total power dissipation is: 150 - 60 --------------------- = 0.82 W 110 Thermal design considerations The `measured' thermal resistance of the IC package is highly dependent on the configuration and size of the application board. All surface mount packages rely on the traces of the PCB to conduct heat away from the package. To improve the heat flow, a significant area on the PCB must be attached to the (ground) pins. Data may not be comparable between different semiconductor manufacturers because the application boards and test methods are not (yet) standardized. Also, the thermal performance of packages for a specific application may be different than presented here, because the configuration of the application boards (copper area) may be different. Philips Semiconductors uses FR-4 type application boards with 1 oz copper traces with solder coating Solder Resist Mask (SRM). The SSOP20 package has improved thermal conductivity which reduces the thermal resistance. Using a practical PCB layout (see Fig.18) with wider copper tracks to the corner pins and just under the IC, the thermal resistance from junction to ambient can be reduced to approximately 80 K/W. For Tamb = 60 C the maximum total power dissipation for this PCB layout is: 150 - 60 = 1.12 W --------------------80 The thermal resistance for the SO20 is approximately 55 K/W if applied to a PCB with wider copper tracks to the corner pins and just under the body of the IC. The maximum total power dissipation for this practical application is: 150 - 60 --------------------- = 1.63 W 55 BTL application
TDA8552T; TDA8552TS
The BTL application diagram is illustrated in Fig.4. The quiescent current has been measured without any load impedance. The total harmonic distortion as a function of frequency was measured with a low-pass filter of 80 kHz. The value of capacitor C3 influences the behaviour of the SVRR at low frequencies, increasing the value of C3 increases the performance of the SVRR. Headphone application Tamb = 25C if not specially mentioned, VDD = 5 V, f = 1 kHz, RL = 32 , Gv = 14 dB, audio band-pass 22 Hz to 22 kHz. For headphone application diagram see: Fig.4 If a headphone is plugged into the headphone jack, the HPS pin will switch-off the outputs of the SLAVE output stage, this results in a mute attenuation >80 dB for the loudspeakers. In this condition the quiescent current will be reduced. General remarks Reduction of the value of capacitor C3 results in a decrease of the SVRR performance at low frequencies. The capacitor value of C5 and C6 in combination with the load impedance of the headphone determines the low frequency behaviour. To prevent against high output currents during inserting the headphone into the headphone jack, resistors of 5.1 have to be connected in series with the SE output lines. The UP/DOWN pin can be driven by a 3-state logic output stage (microprocessor) without extra external components. If the UP/DOWN pin is driven by push-buttons, then it is advised to have an RC-filter between the buttons and the UP/DOWN pin. Advised values for the RC-filter are 2.2 k and 100 nF. Resistor R4 is not necessary for basic operation, but is advised to keep C6 charged to a voltage of 0.5VDD This has the advantage that the plop noise when inserting the headphone plug is minimal. If the headphone sense function (HPS) is not used then the HPS-pin 4 should be hard-wired to ground. This pin should never be left unconnected. Using double push buttons, the volume step for both channels can be controlled. When for the balance control only a single contact is used, the balance steps are 1.25 dB. If double contacts are used for the balance buttons and the dashed connection is made, then the balance steps are 2.5 dB. 15
2002 Jan 04
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
Application without volume control
TDA8552T; TDA8552TS
If pins 6, 7 and 8 are hardwired together the device operates with the volume control setting at maximum. When the supply voltage is connected and the device is switched from standby to mute or operating for the first time then the gain is ramped up from -20 dB to +20 dB. This takes approximately 5 s. This maximum gain setting is maintained until the supply voltage drops below the minimum value.
handbook, full pagewidth
balance left VDD
up VDD volume
2.2 k
UP/DOWN1 100 nF
6
TDA8552T
2.2 k UP/DOWN2 100 nF down
MGM612
7
VDD balance right
Fig.5 Volume and balance control using buttons.
2002 Jan 04
16
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T; TDA8552TS
MGR005
handbook, halfpage
20
handbook, halfpage
40
MGR006
IDD (mA) 15
G (dB) 20
0 10
(1)
-20 5
(2)
-40
0
2
3
4
5
VDD (V)
6
-60
0
20
40
60 volume steps
80
RL = .
VDD = 5 V; RL = 8 . (1) Gv = 30 dB (max.). (2) Gv = 20 dB (max.).
Fig.6 IDD as a function of VDD.
Fig.7 Gain as a function of volume steps.
handbook, halfpage
10
MGR007
handbook, halfpage
10
MGR008
THD (%) 1
(1) (2)
THD (%) 1
(1) (2) (3)
10-1
(3)
10-1
(4)
10-2 10-2
10-1
1
Po (W)
10
10-2 10-2
10-1
1
Po (W)
10
VDD = 5 V; RL = 8 ; f = 1 kHz; Gv = 20 dB (max.). (1) Gv = 0 dB. (2) Gv = 7 dB. (3) Gv = 20 dB.
VDD = 5 V; RL = 8 ; f = 1 kHz; Gv = 30 dB (max.). (1) Gv = 0 dB. (2) Gv = 7 dB. (3) Gv = 20 dB. (4) Gv = 30 dB.
Fig.8 THD as a function of Po.
Fig.9 THD as a function of Po.
2002 Jan 04
17
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T; TDA8552TS
handbook, halfpage
10
MGR009
handbook, halfpage
10
MGR010
THD (%) 1
(1)
THD (%) 1
(1)
(2) (2)
10-1
(3)
10-1
(3)
10-2 10-2
10-1
1
Po (W)
10
10-2 10-2
10-1
1
Po (W)
10
VDD = 5 V; RL = 8 ; Gv = 20 dB (max.). (1) f = 10 kHz. (2) f = 1 kHz. (3) f = 100 Hz.
VDD = 5 V; RL = 8 ; Gv = 30 dB (max.). (1) f = 10 kHz. (2) f = 1 kHz. (3) f = 100 Hz.
Fig.10 THD as a function of Po.
Fig.11 THD as a function of Po.
handbook, halfpage
10
MGR011
handbook, halfpage
10
MGR012
THD (%) 1
(1)
THD (%) 1
(1) (2)
10-1
(2)
(3)
10-1
(3)
10-2 10
102
103
104
f (Hz)
105
10-2 10
102
103
104
f (Hz)
105
VDD = 5 V; RL = 8 ; Po = 0.1 W; Gv = 20 dB (max.). (1) Gv = 0 dB. (2) Gv = 7 dB. (3) Gv = 20 dB.
VDD = 5 V; RL = 8 ; Po = 0.1 W; Gv = 30 dB (max.). (1) Gv = 0 dB. (2) Gv = 7 dB. (3) Gv = 30 dB.
Fig.12 THD as a function of frequency.
Fig.13 THD as a function of frequency.
2002 Jan 04
18
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T; TDA8552TS
handbook, halfpage
0
MGR013
handbook, halfpage
2.4
MGR014
SVRR (dB)
(1)
Vi (V)
(1)
2
(2)
-20 (2)
(3) (4)
1.6
-40 (5)
1.2
0.8 -60 (6) 0.4
-80 10
102
103
104
f (Hz)
105
0 -50
-30
-10
0
10
G (dB)
30
VDD = 5 V; RL = 8 ; Vref = 100 mV. (1) C3 = 10 F; Gv = 20 dB. (2) C3 = 10 F; Gv = 7 dB. (3) C3 = 100 F; Gv = 20 dB. (4) C3 = 10 F; Gv = 10 dB. (5) C3 = 100 F; Gv = 7 dB. (6) C3 = 100 F; Gv = 10 dB.
VDD = 5 V; RL = 8 ; f = 1 kHz; THD = 1%. (1) Gv = 20 dB (max.). (2) Gv = 30 dB (max.).
Fig.14 SVRR as a function of frequency.
Fig.15 Input voltage as a function of gain.
handbook, halfpage
0
MGL436
sup (dB)
handbook, halfpage
0
MGL435
cs (dB)
-20
-20
-40
-40
-60
(1)
-60
(1) (2)
-80
(2)
-80
-100 10
102
103
104 f (Hz)
105
-100 10
102
103
104 f (Hz)
105
VP = 5 V; Vo = 1 V; VHPS = VP. (1) Channel 1. (2) Channel 2.
VP = 5 V; Vo = 1 V. (1) Gv = 30 dB. (2) Gv = 20 dB.
Fig.16 Channel suppression as a function of frequency.
Fig.17 Channel separation as a function of frequency.
2002 Jan 04
19
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T; TDA8552TS
handbook, full pagewidth
77
79
top view
bottom view
GND 220 F
+Vdd
1.5 k
UP 100 nF IN1 MODE 330 nF 20 330 nF 220 F 1 150 nF TDA8552/53TS 100 k 1.5 k DOWN 820 k
IN2 20 dB 30 dB 1 k 220 F 5 HP 5
TDA 8552/53TS
Analog Audio CIC - Nijmegen
- OUT1 +
220 F
1 k
- OUT2 +
MGR015
Fig.18 Printed-circuit board layout.
2002 Jan 04
20
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
PACKAGE OUTLINES SO20: plastic small outline package; 20 leads; body width 7.5 mm
TDA8552T; TDA8552TS
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
2002 Jan 04
21
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T; TDA8552TS
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
D
E
A X
c y HE vM A
Z
20
11
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
10
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.20 0.13 D (1) 6.6 6.4 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC MO-152 EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-22 99-12-27
2002 Jan 04
22
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
TDA8552T; TDA8552TS
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2002 Jan 04
23
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T; TDA8552TS
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
2002 Jan 04
24
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development
TDA8552T; TDA8552TS
DEFINITIONS This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2002 Jan 04
25
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
NOTES
TDA8552T; TDA8552TS
2002 Jan 04
26
Philips Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
NOTES
TDA8552T; TDA8552TS
2002 Jan 04
27
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/03/pp28
Date of release: 2002
Jan 04
Document order number:
9397 750 09236

▲Up To Search▲

Price & Availability of TDA8552TTS3

	To Download TDA8552TTS3 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .